Integrated test circuit

ABSTRACT

A test cell ( 12 ) provides boundary scan testing in an integrated circuit ( 10 ). The test cell ( 12 ) comprises two memories, a flip-flop ( 24 ) and a latch ( 26 ), for storing test data. A first multiplexer ( 22 ) selectively connects one of a plurality of inputs to the flip-flop ( 24 ). The input of the latch ( 26 ) is connected to output of the flip-flop ( 24 ). The output of the latch ( 26 ) is connected to one input of a multiplexer ( 28 ), the second input to the multiplexer ( 28 ) being a data input (DIN) signal. A control bus ( 17 ) is provided for controlling the multiplexers ( 22, 28 ), flip-flop ( 24 ) and latch ( 26 ). The test cell allows input data to be observed and output data to be controlled simultaneously.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of application Ser. No. 10/819,364,filed Apr. 6, 2004, now pending;

which was a divisional of application Ser. No. 10/280,980, filed Oct.25, 2002, now U.S. Pat. No. 6,813,738;

which was a divisional of application Ser. No. 09/898,249, filed Jul. 3,2001, now U.S. Pat. No. 6,611,934;

which was a divisional of application Ser. No. 09/521,320, filed Mar. 9,2000, now U.S. Pat. No. 6,304,987;

which was a divisional of application Ser. No. 08/826,310, filed Mar.25, 1997, now U.S. Pat. No. 6,081,916;

which was a divisional of application Ser. No. 08/476,003, filed June 7,1995, now U.S. Pat. No. 5,631,911;

which was a divisional of application Ser. No. 08/271,384, filed Jul. 6,1994, now abandoned;

which was a continuation of application Ser. No. 08/186,486, filed Jan.25, 1994, now abandoned;

which was a continuation of application Ser. No. 08/087,020, filed Jul.6, 1993, now abandoned;

which was a continuation of application Ser. No. 07/970,529, filed Nov.2, 1992, now abandoned;

which was a continuation of application Ser. No. 07/876,694, filed Apr.28, 1992, now abandoned;

which was a continuation of application Ser. No. 07/609,124, filed Nov.1, 1990, now abandoned;

which was a continuation of application Ser. No. 07/241,520, filed Sep.7, 1988, now abandoned.

This application relates to U.S. Pat. No. 5,495,487, entitled “TestingBuffer/Register”, incorporated herein by reference.

This application relates to U.S. Pat. No. 5,084,874, entitled “EnhancedTest Circuit”, incorporated herein by reference.

This application relates to U.S. Pat. No. 5,602,855, which issued fromthe original application from which this application claims priority.

TECHNICAL FIELD OF THE INVENTION

This invention relates in general to integrated circuits, and moreparticularly to a test cell used in an integrated circuit for providinga boundary scan test structure.

BACKGROUND OF THE INVENTION

Due to advances in the fields of board interconnect technology, surfacemount packaging and IC density, board level testability is becomingincreasingly complex. The combination of advanced board interconnecttechnology, such as buried wire interconnects and double-sided boards,along with surface mount packaging creates problems for in-circuittesting of the boards. In-circuit testing, the most common board leveltesting method, depends upon the ability to physically probe the nodesof a circuit board. As board density (the number of ICs on a board)increases, the process of probing the board using traditional techniquesbecomes more difficult, due to the lack of physical access.

As the IC density (amount of logic on a chip) increases, the number oftest patterns required for proper testing likewise increases. In-circuittesting relies on back-driving techniques to force input conditions totest a particular IC in a circuit. When such test is being applied toone IC on a board, neighboring ICs; whose output buffers are tied to thesame nodes, may be damaged. The chance of damaging a neighboring ICincreases with the length of time it takes to perform a test, which isdirectly related to the number of test patterns applied, and therefore,related to the IC density.

Therefore, a need has arisen in the industry to provide a test structurewhich provides access to particular ICs on a board, and allows testingof particular ICs without risk of damage to neighboring ICs.

SUMMARY OF THE INVENTION

In accordance with the present invention, a boundary scan test system isprovided which substantially eliminates the disadvantages and problemsassociated with prior testing systems.

The boundary scan test system of the present invention comprises a firstmultiplexer connecting a plurality of inputs to a first memory,responsive to control signals provided by a control bus. The output ofthe first memory is connected to a second memory. The output of thesecond memory is connected to an input to a second multiplexer alongwith one or more other inputs. The second multiplexer is controlled byanother control signal on the control bus. The output of the firstmemory and the output of second memory are connected to the firstmultiplexer as inputs.

The present invention provides a variety of functions for testingpurposes. The test cell is operable to both reserve data inputs andcontrol data outputs to and from the cell. The test cell may operate intwo modes: “normal” mode and “testing” mode. In normal mode, the testcell provides a data path through which inputs and outputs may propagatefreely through the test cell. While in the normal mode, the test cellcan also load and shift test data, remain in an idle state, or toggletest data without disturbing the normal operation of the integratedcircuit. Further, while in normal mode, a predetermined test data bitmay be inserted into the data stream. Also, the test cell may perform aself-test while in the normal mode to insure correct operation of thetest cell.

In the test mode, the test cell inhibits the normal flow of data throughthe test cell.

Normally, the test cells in the integrated circuit will have beenprepared to output an initial test pattern. While in the test mode, thetest cell may perform Idle, Load, Shift, and Toggle operations.

The present invention provides significant advantages over the priorart. First, the test cell of the present invention may be used toperform internal and external boundary testing simultaneously, in orderto reduce overall test time. Second, the test cells are capable ofsampling or inserting data at the boundary during normal operation ofthe host integrated circuit. Third, the test cell is synchronous inoperation with a free running test clock. Fourth, the present inventionprovides a method of toggling an IC's output buffers, independent of theIC's application logic, in order to achieve parametric measures and tofacilitate boundary test. Fifth, the test cell provides self-testingcapabilities.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention and theadvantages thereof, reference is now made to the following descriptionstaken in conjunction with the accompanying drawings, in which:

FIG. 1 illustrates circuit diagram of an integrated circuit having testcells disposed at the boundary of the internal application logic;

FIG. 2 illustrates a circuit diagram of a preferred embodiment of thetest cell of the FIG. 1;

FIG. 3 illustrates a circuit diagram interconnections between test cellson an integrated circuit;

FIG. 4 a illustrates a circuit diagram of a preferred embodiment of abidirectional test cell;

FIG. 4 b illustrates a diagram of the bidirectional test cell of FIG. 4a as disposed within an integrated circuit; and

FIG. 5 illustrates an implementation of the test cell of the presentinvention.

FIG. 6 illustrates a test circuit comprising a base test cell withcompare logic circuitry;

FIG. 7 illustrates a test circuit comprising a base test cell withPRPG/PSA logic circuitry;

FIG. 8 illustrates a test circuit comprising a base test cell withPRPG/PSA logic circuitry and programmable polynomial tap logiccircuitry;

FIGS. 9 a-b illustrate interconnections between test circuits havingprogrammable polynomial tap logic circuitry;

FIG. 10 illustrates a bidirection test cell having PRPG/PSA testcircuitry;

FIG. 11 illustrates a bidirectional test cell having PRPG/PSA testcircuitry and programmable polynomial tap circuitry;

FIG. 12 illustrates a circuit using test devices to observe inputs andcontrol outputs to and from standard combinational logic;

FIG. 13 illustrates a circuit diagram of a preferred embodiment of atest device of FIG. 12;

FIG. 14 illustrates a circuit diagram of a test device performing PSAoperations; and

FIG. 15 illustrates a circuit diagram of a test device performingsimultaneous PSA and PRPG operations.

DETAILED DESCRIPTION OF THE INVENTION

The preferred embodiment of the present invention is best understood byreferring to FIGS. 1-5 of the drawings, like numerals being used forlike and corresponding parts of the various drawings.

FIG. 1 illustrates a block diagram of an integrated circuit (IC) 10having test cells 12 a-h disposed about its boundary to control andobserve data flow through the application logic 14 of the IC 10. Theintegrated circuit 10 comprises a plurality of pins 16 which provide anelectrical connection between the integrated circuit 10 and otherintegrated circuits. For purposes of illustration, the integratedcircuit 10 is shown with four pins receiving input signals, IN1, IN2,IN3 and IN4, and four pins providing output signals, OUT1, OUT2, OUT3and OUT4. Other signals to the chip include a serial data input (SDI), acontrol bus 17, and a serial data output (SDO). The input signalsIN1-IN4 are connected to input buffers 18 which output to respectivetest cells 12 a-d. Each test cell 12 a-h has its own serial data inputand serial data output, enumerated SDI 1-8 and SDO 1-8. In theillustrated configuration, the SDI input to the IC 10 is connected toSDI1 of test cell 12 a; the SDI inputs of subsequent cells 12 b-hreceive the SDO of the previous cell. Hence, SDO1 is connected to SDI2,SDO2 is connected to SDI3, and so on. SDO8 is connected to the SDO pinof the IC 10. The control bus 17 is connected in parallel to each of thetest cells 12 a-f.

Each test cell includes a data input (DIN) and a data output (DOUT). Forthe input test cells 12 a-d, DIN is connected to the output ofrespective buffers 18 and DOUT is connected to the inputs of theapplication logic 14. The inputs of the application logic 14 areenumerated IT1′-IN4′, corresponding to the inputs IN1-IN4. IN1′-IN4′would be the inputs to the chip were not the test structure provided.

The output from the application logic 14 are referenced as OUT1′, OUT2′,OUT3′ and OUT4′. The outputs of the application logic OUT1′-OUT4′ areconnected to the data inputs (DINs) of the output test cells 12 e-h. Thedata outputs (DOUTs) of the output test cells 12 e-h are connected tooutput buffers 20 corresponding to OUT signals OUT1-OUT4.

The test cells 12 a-h provide the basis for a great deal of testfunctionality within the integrated circuit 10. The SDI enters the IC 10through test cell 12 a and may propagate to each subsequent cell 12 b-h,eventually being output from test cell 12 h through SDO8. The serialdata path is used to shift data into and out of each of the test cells12 a-h.

The control bus provides signals for operating each of the test cells 12a-h during testing, and is described in more detail in connection withFIGS. 2-3. When placed in a test mode, the test cells 12 a-h inhibit thenormal flow of data into and out of the IC 10. In the test mode, eachtest cell 12 a-h controls the logic node attached to its output andobserves the logic node attached to its input. For example, in FIG. 1,the test cells 12 a-d attached to the four inputs IN1-IN4, can observethe logic levels on the IN1-IN4 inputs and control the logic levels onthe IN1′-IN4′ outputs. Similarly, the test cells 12 e-h, connected tothe four outputs can observe the logic levels on the OUT1′-OUT4′ inputsand control the logic levels on the OUT1-OUT4 outputs.

In FIG. 2, a detailed block diagram of an individual test cell 12 isprovided. The test cell 12 has three data inputs: data in (DIN),observability data in (ODI), and serial data in (SDI). Two data outputsare provided: data out (DOUT) and serial data out (SDO). The control bus17 comprises five signals, data input multiplexer selects, A and B, aregister clock signal (CLK), a latch enable (HOLD), and a data outputmultiplexer select (DMX).

A first multiplexer 22 receives the ODI and SDI signals, along with theoutput of a D-type flip-flop 24 and the inverted output of a D-typelatch 26. The output of the multiplexer 22 is connected to the input ofthe flip-flop 24. The CLK signal is connected to the flip-flop clockinput. The output of the flip-flop 24 is connected to the input of thelatch 26 and also provides the SDO signal. The output of the latch 26 isconnected to the input of a second multiplexer 28 along with the DINsignal. The HOLD signal is connected to the latch enable. The output ofthe multiplexer 28 provides the DOUT signal. The multiplexer 28 isenabled by the DMX signal.

In operation, the 4:1 multiplexer 22 allows the input to the flip-flop24 to be selected from one of four possible sources: ODI, SDI, theoutput of the flip-flop 24 or the inverted output of the latch 26. Thelatch 26 can be controlled to propagate the output of the flip-flop 24or to hold its present state, depending upon the logic level applied bythe HOLD input. The 2:1 multiplexer 28 allows the DOUT output to bedriven by either the DIN input or the output of the latch 26, dependingupon the logic level applied by the DMX input. The combination of the4:1 multiplexer 22, flip-flop 24, latch 26 and 2:1 multiplexer allowsthe test cell 12 to operate in four synchronous modes: load, shift,toggle and idle.

In load mode, the test cell 12 clocks the logic state of the ODI inputinto the D flip-flop 24 through the multiplexer 22. The ODI input iscoupled to a signal that is to be observed during tests and, in mostcases, the ODI input will be attached to the same boundary signal thatis connected to the test cell's DIN input. However, the ODI can beconnected to other signals as well. To cause a load operation to occur,the A and B inputs are set to predetermined levels, allowing the ODIinput to be connected to the flip-flop 24 via the 4:1 multiplexer 22.Normally, the HOLD input to the latch 26 is low, forcing the latchoutput to remain in its present state during a load operation.

In shift mode, the test cell clocks the logic state of the SDI inputinto the flip-flop 24 and outputs this logic state via the SDO output.The shift mode allows the test cells 12 in the boundary scan path to beinterconnected together so that serial data can be shifted into and outof the boundary scan path. In a boundary scan configuration, the SDIinput of the test cell is coupled to a preceding test cell's SDO output,as shown in FIG. 1. To cause the shift operation to occur, the A and Binputs are set to predetermined levels, allowing the SDI input to beconnected to the flip-flop 24 via the 4:1 multiplexer. Normally, theHOLD input to the latch 26 is kept low, forcing the latch output toremain in its present state during the shift operation.

In toggle mode, the output of the flip-flop 24 toggles between two logicstates at the rate of the CLK input, regardless of the condition of theSDI or ODI inputs. In this configuration, the HOLD input is set to ahigh logic level to enable the latch 26 and the A and B inputs are setsuch that the inverted output of the latch 26 is propagated to theflip-flop 24. With the control input set in this manner, a feedback pathis formed from the output of the flip-flop 24 to the input of the latch26 and from the inverted output of latch 26 to the input of theflip-flop 24. Because of the data inversion at the inverted output ofthe latch 26, the opposite logic state is clocked into the flip-flop 24on each CLK input, creating the toggle effect.

In idle mode, the test cell remains in present state while the CLK isactive, regardless of the condition of the SDI or ODI inputs. In thisconfiguration, the output of the flip-flop 24 is passed through the 4:1multiplexer 22; hence, the input of the flip-flop 24 is connected to itsoutput, allowing the present state of the flip-flop 24 to be refreshedon every clock input.

The test cell 12 can be in either “normal” mode or “testing” mode. Innormal mode, the test cell 12 provides the data path through which theinputs (IN1-IN4) and output (OUT1-OUT4) propagate freely. The normalmode is achieved by setting the DMX signal such that the DIN signalpasses through the multiplexer 28 to DOUT. While in the normal mode, thetest cell 12 can operate in any of the four synchronous modes (load,shift, idle or toggle) without disturbing the normal operation of the IC10.

A control signal can be issued via the A and B inputs to cause the testcell 12 to execute a load operation. The load operation causes the testcell 12 to capture the logic level present on the ODI input. Once thedata has been captured, it can be shifted out of the test cell 12 byperforming a shift operation. The load operation occurs synchronous withthe CLK input.

Following the shift operation, the test cell 12 typically returns to theidle mode. This capability allows the test cell 12 to sample an IC'sinput and/or output boundary signals and shift the sample data out forinspection during normal operation of the IC. The ability to sampleboundary data during normal operations allows the test cell 12 to verifythe functional interactions of multiple ICs on a circuit board withouthaving to use expensive test equipment and external test probes.

Also while in normal mode, control can be issued via the DMX input tocause the test cell 12 to insert a predetermined test data bit into thenormal input/output boundary path of the IC.

The test data bit to be inserted is shifted into the flip-flop 24 via ashift operation. The HOLD input to the latch 26 is set high to allow thetest data in the flip-flop to pass through the latch and input to the2:1 multiplexer 28. To insert the test data, the DMX input is set to alevel causing the multiplexer to propagate the test data from the outputof the latch 26 to the DOUT output. After the test data has beeninserted, the DMX input is switched to cause the 2:1 multiplexer 28 topropagate normal data from DIN to DOUR.

The ability to insert test data during normal operations allows the testcells to modify the normal behavior of one or more ICs in a circuit. Oneparticular usage of the insert capability is to propagate a fault intothe input and/or output boundary of one or more ICs of a circuit boardto see if the fault can be detected and corrected. In order to performthe sample and insert test functions during normal operation, the testcell 12 must receive control via the control bus 17 at a qualified pointin time.

The test cell 12 can also perform a self-test while in the normal modewithout disturbing the normal operation of the IC 10. A shift operationmay be performed to initialize the flip-flop 24 to a known state.Following the shift operation, control is issued to cause the test cell12 to enter the toggle mode for one CLK transition. During thistransition, the flip-flop is loaded with the inverse of its state.Following this inversion of data, another shift operation is performedto retrieve the contents of the flip-flop 24 and verify the inversionoperation. This test verifies the combined operation of each of the testcell's flip-flop 24, 4:1 multiplexer 22, and latch 26, along with theintegrity of the overall boundary scan path.

In the test mode, the test cell 12 inhibits the normal flow of data fromthe DIN input to the DOUT output. The test mode is entered by settingthe DMX input to a level such that the output of the latch 26 isconnected to the DOUT output. Normally, prior to entering the test mode,the test cell 12 will have been prepared to output an initial testpattern, via a shift pattern. Also, the test cell 12 will usually be inan idle state and the HOLD input to the D latch will be set low, suchthat its present output is maintained.

While in the test mode, a load operation may be executed, causing thetest cell 12 to capture the logic level present on the ODI input. Theload operation occurs synchronous with the CLK input. During a loadoperation, the HOLD input is set low, such that the D latch remains inits present state. Likewise, the DOUT output remains in its presentstate, since it is driven by the latch output.

Following the load operation, a shift operation is performed, causingthe test cell 12 to shift data through the flip-flop 24 from the SDIinput to the SDO output. The shift operation allows the test cell toshift out the data captured during a previous load operation and shiftin the next output test data to apply to the DOUT output. The shiftoperation occurs synchronous with the CLK input. During a shiftoperation, the HOLD input is held low, such that the output of the latch26 remains in its present state. Likewise, the DOUT output remains inits present state, since it is driven by the latch output.

Following the load and shift operation sequence, the test cell 12returns to the idle mode and the HOLD input will be set high, such thatthe latch 26 is updated with the new output test data residing in theflip-flop 24. When the latch 26 is updated, the new output test data isapplied to the DOUT output. Following the update operation, the HOLDinput is set low such that the latch 26 remains in its present stateduring subsequent load and shift operations.

The HOLD, load, shift, and update/apply sequence is repeated duringboundary scan testing of the internal and external logic elementsattached to the ICs test circuitry. By providing separate memoryelements for output test control (i.e., latch 26) and input testobservation and shifting (i.e., flip-flop 24), the test cell 12 can testthe internal logic of an IC 10 and the external logic and/or wiringinterconnects attached to the IC's boundary simultaneously. This featurereduces test time significantly.

While in the test mode, the test cell 12 can perform a toggle operation.Since the output of the latch 26 is coupled to the DOUT output duringtest mode, the DOUT output can be made to toggle at the rate of the CLKinput when the toggle operation is performed. The advantage of using a Dlatch instead of a second D flip-flop is that the D latch can be made topropagate the Q output of the D flip-flop by setting the HOLD inputhigh. The toggle mode can be used as a simple test pattern generator orfor measuring parameters of the output buffers 20 of the IC 10.

FIG. 3 illustrates a simplified view of an IC design having one input(IN), one output (OUT), an application logic section 14, and a boundaryscan path consisting of two test cells 12 i and 12 j. The input to theapplication logic 14 is connected to the output of the 2:1 multiplexer28 of test cell 12 i, and is denoted as IN′. The output of theapplication logic is denoted as OUT′ and is connected to the DIN and ODIsignals of the test cell 12 j.

The IN input enters the DIN input of the input test cell 12 i, passesthrough the 2:1 multiplexer 28, and is output to the application logic14 from the input test cells DOUT output, via IN′. Likewise, theapplication logic output, OUT′, enters the DIN input of the output testcell 12 j, passes through its 2:1 multiplexer 28, and is output from theIC from the output test cell DOUT output, via OUT. The ODI input of theinput test cell 12 i is attached to the ICs input (IN) and the ODI inputof the output test cell 12 j is attached to the application logic output(OUT′). The SDI input of the IC is coupled to the input test cell's SDIinput and the IC serial data output (SDO) is coupled to the output testcell SDO output. A serial data path exists between the SDO of the inputtest cell 12 i output and the SDI input of the output test cell 12 j,creating an internal connection between the test cells for shiftingdata. The control bus signals (A, B, CLK, HOLD, and DMX) are connectedto both test cells 12 i and 12 j, allowing both to operate together in asynchronous manner.

In the normal mode, data flows into the application logic 14 from the INto the IN′ via the input test cell 12 i, and flows from the applicationlogic from OUT′ to OUT via the output test cell 12 j. The followingexamples describe the sequence of control signals issued via the controlbus 17 to cause the test cells 12 i and 12; to perform a sample and aninsert test operation at the boundary of the IC in FIG. 3 during normaloperation.

Sample Operations Sequence

Initially both test cells are in Normal Mode and Idle Mode

Control Bus: DMX=0, BA=11, HOLD=0, CLK=Active

(where BA equals the select control signals issued to the 4:1multiplexor 22)

Application Logic's IN′ input is driven by the IC's IN input

IC's OUT output is driven by the Application Logic's OUT′ output

Both test cells' D latches remain in their present state

Both test cells' D flip-flops remain in their present state

Enter Load Mode for one CLK to capture input and output boundary data

Control Bus: DMX=0, BA=00, HOLD=0, CLK=Active

Application Logic's IN′ input is driven by the IC's IN input

IC's OUT output is driven by the Application Logic's OUT′ output

Both test cells' D latches remains in their present state

Both test cells' D flip-flops clock in the logic level on their ODIinput

Enter Shift Mode for two CLKs to shift out captured data

Control Bus: DMX=0, BA=00, HOLD=0, CLK=Active

Application Logic's IN′ input is driven by the IC's IN input

IC's OUT output is driven by the Application Logic's OUT′ output

Both test cells' D latches remains in their present state

Both test cells' D flip-flops clock in the logic level on their SDIinput

Enter Idle mode, test complete

Control Bus: DMX=0, BA=11, HOLD=0, CLK=Active

Application Logic's IN′ input is driven by the IC's IN input

IC's OUT output is driven by the Application Logic's OUT′ output

Both test cells' D latches remains in their present state

Both test cells' D flip-flops remain in their present state.

Test Data Insert Operation Sequence

Initially both test cells are in Normal Mode and Idle Mode

Control Bus: DMX=0, BA=11, HOLD=0, CLK=Active

Application Logic's IN′ input is driven by the IC's IN input

IC's OUT output is driven by the Application Logic's OUT′ output

Both test cells' D latches remain in their present state

Both test cells' D flip-flops remain in their present state

Enter Shift Mode for two CLKs to load test data to insert

Control Bus: DMX=0, BA=00, HOLD=0, CLK-Active

Application Logic's IN′ input is driven by the IC's IN input

IC's OUT output is driven by the Application Logic's OUT′ output

Both test cells' D latches remains in their present state

Both test cells' D flip-flops clock in the logic level on their SDIinput

Enter Idle Mode and update both test cells' D latches with test data toinsert

Control Bus: DMX=0, BA=11, HOLD=“0,1,0”, CLK=Active

Application Logic's IN′ input is driven by the IC's IN input

IC's OUT output is driven by the Application Logic's OUT′ output

Both test cells' D latches update to the logic level in the D flip-flops

Both test cells' D flip-flops remain in their present state

Remain in Idle Mode, set DMX high to insert test data

Control Bus: DMX=1, BA=11, HOLD=0, CLK=Active

Application Logic's IN′ input is driven by input test cells' D latch

IC's OUT output is driven by output test cells' D latch

Both test cells' D latches remain in their present state

Both test cells' D flip-flops remain in their present state

Remain in Idle Mode, set DMX low to remove test data, test complete

Control Bus: DMX=0, BA=11, HOLD=0, CLK=Active

Application Logic's IN′ input is driven by the IC's IN input

IC's OUT output is driven by the Application Logic's OUT′ output

Both test cells' D latches remain in their present state

Both test cells' D flip-flops remain in their present state

During test mode, the normal flow of input and output data through thetest cells 12 i and 12 j is inhibited. In the test mode, the input testcell 12 i controls the IN′ input to the application logic and observesthe IN input to the IC. Likewise, the output test cell 12 j controls theOUT output from the IC 10 and observes the OUT′ output from theapplication logic. The following examples describe the sequence ofcontrol issued via the control bus to cause the test cells 12 i and 12 jto perform a boundary scan test and output buffer toggle operation.

Boundary Scan Test Operation Sequence

Initially both test cells are in Normal Mode and Idle Mode

Control Bus: DMX=0, BA=11, HOLD=0, CLK=Active

Application Logic's IN′ input is driven by the IC's IN input

IC's OUT output is driven by the Applicatioi Logic's OUT′ output

Both test cells' D latches remain in their present state

Both test cells' D flip-flops remain in their present state

Enter Shift Mode for two CLKs to shift in the first output test pattern

Control Bus: DMX=0, BA=00, HOLD=0, CLK=Active

Application Logic's IN′ input is driven by the IC's IN input

IC's OUT output is driven by the Application Logic's OUT′ output

Both test cells' D latches remains in their present state

Both test cells' D flip-flops clock in the logic level on their SDIinput

Enter Idle Mode, update D latches with first output test pattern

Control Bus: DMX=0, BA=11, HOLD=“0,1,0”, CLK=Active

Application Logic's IN′ input is driven by the IC's IN input

IC's OUT output is driven by the Application Logic's OUT′ output

Both test cells' D latches update to the logic level in the D flip-flops

Both test cells' D flip-flops remain in their present state

Remain in Idle Mode, enter Test Mode, apply first output test pattern

Control Bus: DMX=1, BA=11, HOLD=0, CLK=Active

Application Logic's IN′ input is driven by input test cells' D latch

IC's OUT output is driven by output test cells' D latch

Both test cells' D latches remains in their present state.

Both test cells' D flip-flops remain in their present state

Enter Load Mode for one CLK; to capture input and output boundary data

Control Bus: DMX=1, BfA=01, HOLD=0, CLK=Active

Application Logic's IN′ input is driven by input test cells' D latch

IC's OUT output is driven by output test cells' D latch

Both test cells' D latches remains in their present state

Both test cells' D flip-flops clock in the logic level on their ODIinput

Enter Shift Mode for two CLKs to shift out captured data and shift innext output test pattern

Control Bus: DMX=1, BA=00, HOLD=0, CLK=Active

Application Logic's IN′ input is driven by input test cells' D latch

IC's OUT output is driven by output test cells' D latch

Both test cells' D latches remains in its present state

Both test cells' D flip-flops clock in the logic level on their SDIinput

Enter Idle Mode, update D latches to apply next output test pattern

Control Bus: DMX=1, BA=11, HOLD=“0,1,0”, CLK=Active

Application Logic's IN′ input is driven by input test cells' D latch

IC's OUT output is driven by output test cells' D latch

Both test cells' D latches update to logic level to the D flip-flops

Both test cells' D-flip-flops remain in their present state

Repeat steps 5 through 1 until boundary test is complete, then issuecontrol to return to Normal mode and Idle mode (Step 1)

Output Buffer Toggle Operation Sequence

Initially both test cells are in Normal Mode and Idle Mode

Control Bus: DMX=0, BA=11, HOLD=0, CLK=Active

Application Logic's IN′ input is driven by the IC's IN input

IC's OUT output is driven by the Application Logic's OUT′ output

Both test cells' D latches remain in their present state

Both test cells' D flip-flops remain in their present state

Enter Shift Mode for two CLKs to shift in the output buffer togglepattern

Control Bus: DMX=0, BA=00, HOLD=0, CLK=Active

Application Logic's IN′ input is driven by the IC's IN input

IC's OUT output is driven by the Application Logic's OUT′ output

Both test cells' D latches remains in their present state

Both test cells' D flip-flops clock in the logic level on their SDIinput

Enter Idle Mode, update D latches with output test pattern

Control Bus: DMX=0, BA=11, HOLD=“0,1,0”, CLK=Active

Application Logic's IN′ input is driven by the IC's IN input

IC's OUT output is driven by the Application Logic's OUT′ output

Both test cells' D latches update to the logic level in the D flip-flops

Both test cells' D flip-flops remain in their present state

Remain in Idle Mode, enter Test Mode, apply output test pattern

Control Bus: DMX=1, BA=11, HOLD=0, CLK=Active

Application Logic's IN′ input is driven by input test cells' D latch

IC's OUT output is driven by output test cells' D latch

Both test cells' D latches remains in their present state

Both test cells' D flip-flops remain in their present state

Enter Toggle Mode, Set HOLD input high, Toggle test begins (for “N”clock inputs)

Control Bus: DMX=1, BA=10, HOLD=1, CLK=Active

Application Logic's IN′ input is driven by input test cells' D latch

IC's OUT output is driven by output test cells' D latch

Both test cells' D latches pass data from D flip-flop to DOUT output

Both test cells' D flip-flops clock in the Q-D latch output

Enter Idle Mode, Set HOLD and DMX input low, Toggle test complete

Control Bus: DMX=0, BA=11, HOLD=0, CLK=Active

Application Logic's IN′ input is driven by the IC's IN input

IC's OUT output is driven by the Application Logic's OUT′ output

Both test cells' D latches remain in their present state

Both test cells' D flip-flops remain in their present state

NOTE: In FIG. 3, if it is desired not to toggle the input test cellduring the Toggle test, a separate HOLD input can be used to force theoutput of the input test cell to be static while the output test celltoggles. Likewise separate control (A and B) can cause the input testcell into an Idle mode while the output test cell is toggling.

Referring now to FIG. 4 a, a block diagram of a preferred implementationof a bidirectional test cell 30 is illustrated. The bidirectional testcell 30 may be used in connection with an input/output pin, throughwhich signals may flow in both directions. The bidirectional cell 30uses the test cell 12 illustrated in FIG. 2 as a base cell, addingadditional circuitry to provide bidirectional operation. Specifically,the bidirectional cell 30 provides three additional multiplexers 32, 34and 36. The first multiplexer 32 has two inputs SYSG (the systemtristate enable) and TSTG (the test tristate enable). The multiplexer iscontrolled by a SELG (select enable) signal, which selects one of thetwo inputs. The output of the first multiplexer 32 is the OBG (outputbuffer tristate enable). The OBG signal controls the output state of theIC's tristate output buffer.

The second multiplexer 34 receives two inputs, a DINA signal and a DINBsignal. The multiplexer 34 is controlled by the output of themultiplexer 32, the OBG signal. The DINA input is an output from theIC's application logic 14 and the DINB input is the external input fromthe I/O buffer. The OBG signal output from the multiplexer 32 is used toselect between inputs of the multiplexer 34.

The third multiplexer 36 has two inputs, DINA and the non-invertedoutput (LQ) from the latch 26 of the base test cell 12. This thirdmultiplexer 36 is controlled by the DMX signal.

The output of the second multiplexer 34 is connected to the ODI input ofthe base test cell 12. The output of the third multiplexer 36 is denotedas DOUTA and the DOUT signal from the base test-cell 12 is denoted asDOUTB.

In operation, the OBG output is driven by the SYSG input (normal modetristate control input) when the SELG input is low. When the SELG inputis high, the OBG output of the first multiplexer 32 is driven by theTSTG input (test mode tristate control input). In FIG. 4 a, it isassumed that a low output on the OBG signal will cause an output bufferto be active and high output on the OBG signal will cause an outputbuffer to be tristate.

The second multiplexer 34 is controlled by the OBG output from the firstmultiplexer 32. The purpose of the second multiplexer is to couple oneof the two data inputs, DINA or DINB, to the ODI input of the base testcell, to allow the appropriate signal to be sampled during a loadoperation. The DINA input to the second multiplexer 34 is an output fromthe application logic. When the second multiplexer's select input OBG isset low, indicating an output operation from the application logic, theDINA signal is coupled to the ODI input of the base test cell 12 and canbe sampled during a load operation. When the second multiplexer's selectinput CBG is set high, indicating an input operation to the applicationlogic, the DIED signal is coupled to the ODI input of the test cell 12and can be sampled during a load operation. The third multiplexer 36 iscontrolled by the DMX signal, also sent to the test cell 12. The LQoutput of the test cell 12 is the output of the D latch 26 inside thetest cell 12. The LQ output allows holding the DOUTA output signalconstant in test mode during load and shift operations. When the DMXinput to the test cell 12 and third multiplexer 36 is set low, thebidirectional cell 30 is in normal mode. In the normal mode, the DINAoutput passes through the third multiplexer 36 and is output from thecell via the DOUTA output, establishing the normal data output path fromthe application logic 14 to the output buffer section of an I/O buffer.Likewise, in the normal mode, the DINB input passes through the 2:1multiplexer 28 within the test cell 12 and is output from the cell viathe DOUTB output, establishing the normal data input path from the inputbuffer section of an I/O buffer to the application logic 14.

When the DMX input to the test cell 12 and third multiplexer 36 is sethigh, the bidirectional test cell 30 is placed in the test mode. In thetest mode, the test cell LQ test data output passes through the thirdmultiplexer 36 is output from the scope cell via the DOUTA output,establishing the test data output path from the test cell 12 to theoutput buffer section of an I/O buffer. Likewise, in the test mode, theinternal test cells LQ test data output passes through the test cell'sinternal 2:1 multiplexer 28 and is output from the test cell 12 via theDOUTB output, establishing the test data output path from the test cellto the application logic 14.

In FIG. 4 b, a block representation of bidirectional test cell 30 isshown connected between a bidirectional buffer and application logic 14.When a data output operation is performed, the output buffer 38 isenabled by OBG. In the normal mode, the data from the application logic14 enters the bidirectional test cell 30 via the DINA input, passesthrough the bidirectional test cell 30 and is coupled to the outputbuffer 38 via the DOUTA output. The DOUTA output passes through theoutput buffer 38 and is applied to the I/O pin 40. In test mode, thetest data stored in the bidirectional test cell 30 is supplied to theoutput buffer via the DOUTA output, passes through the output buffer 38and is applied to I/O pin 40.

When a data input operation is performed, the output buffer is placed ina high impedance state by the OB signal in normal mode, the data fromthe I/O pin 40 enters the bidirectional test cell 30 via the inputbuffer 41 and the DINB input, passes through the test cell 30, and isapplied to the application logic via the DOUTB output. In test mode, thetest data stored in the test cell 30 is applied to the application logicby the DOUTB output.

Referring now to FIG. 5, there is shown a schematic diagram representinga particular implementation of the test cell 12. The implementationcomprises multiplexers 22 and 28, D flip-flop 24 and latch 26.

The first multiplexer 22 has six independent input signals. The SDIsignal is input to two cascaded inverters 108 and 110. The resultingoutput from inverter 110 is then input to a transmission gate 112. Atransmission gate is formed by tying both the sources and drains of a Pchannel transistor to an N channel transistor The output of transmissiongate 112 is tied to the output of transmission gate 114 and to the inputto transmission gate 116. The output of transmission gate 116 islikewise tied to the output of transmission gate 122 and to the input toa pair of cascaded inverters 118 and 120. This output at inverter 120represents the final output from multiplexer 22.

The ODI input to multiplexer 22 is connected to transmission gate 114.The output of transmission gate 114 is tied to the output oftransmission gate 112 and to the input to transmission gate 116.

A third input to multiplexer 22 is the inverted output of latch 26. Thissignal is input into transmission gate 124. The output of transmissiongate 124 is tied to the output of transmission gate 126 and to the inputto transmission gate 122.

A fourth input to multiplexer 22 is the output of the D flip-flop 24.This signal is input to transmission gate 126. The output oftransmission gate 126 is then tied to the output of transmission gate124 and to the input to transmission gate 122. The resultant output fromtransmission gate 122 is then tied to the output transmission gate 116.

The two remaining inputs of multiplexer 22 act as select signals for thevarious transmission gates within the multiplexer 22. Input signal A isfirst connected to inverter 128. The output of inverter 128 is thenconnected to the input of inverter 130. Additionally, the output ofinverter 128 is further connected to the P channel gate of transmissiongates 114 and 126. The same output is connected to the N channel gate oftransmission gates 112 and 124. The output of inverter 130 is connectedto the P channel gate of transmission gates 112 and 124 and the Nchannel gate of transmission gates 114 and 126.

The B input to multiplexer 22 is also used as a select signal. The Binput is connected to inverter 132. The output of inverter 132 isconnected to inverter 134. Additionally, the output of inverter 132 isconnected to the P channel gate of transmission gate 122 and the Nchannel gate of transmission gate 116. The output of inverter 134 isconnected to the N channel gate of transmission gate 122 and the Pchannel gate of transmission gate 116.

The D flip-flop 24 is connected to both a clock input CLK and the outputof multiplexer 22. Within the D flip-flop 24, the clock signal is inputto inverter 140, whose output is used to control the gate of N channeltransistor 142. The clock signal is also used to control the gate of Nchannel transistor 144. The D input of D flip-flop 24 is connected tothe first source/drain of N channel transistor 142. The secondsource/drain of transistor 142 is connected to the input of inverter146. The output of inverter 146 is connected to the first source/drainof N channel transistor 144 and also to the input of inverter 148. Theoutput of inverter 148 is connected to the input of inverter 146. Thesecond source/drain of transistor 144 is connected to the input ofinverter 150. The output of inverter 150 is connected both to the inputof inverter 152 and the input of inverter 154. The output of inverter154 is connected to the input of inverter 150. The output of inverter150 is also connected to the input of the transmission gate 126. Theoutput of inverter 152 is the inverted output of the D flip-flop 24. Theinverted output of D flip-flop 24 is then input to inverter 156. Theoutput of inverter 156 is the SDO output of the test cell.

The output of D flip-flop 24 (output of inverter 150) is connected tothe D input of latch 26. This input is connected to the firstsource/drain of N channel transistor 160. The second source/drain of Nchannel transistor 160 is connected to the input of inverter 162. Withinlatch 26, the output of inverter 162 is connected to the input ofinverter 166 and inverter 164. The output of inverter 166 is connectedto the input of inverter 162. The output of inverter 162 also representsthe inverted output of latch 26. As mentioned above, this invertedoutput is connected to multiplexer 22 through transmission gate 124. Theoutput of inverter 164 represents the non-inverted output of the latch26, which is connected to multiplexer 28. The latch 26 is alsocontrolled by a hold voltage input to the base of N channel transistor160.

The second multiplexer 28 within the test cell has three separateinputs, DIN, the output of inverter 164, and DMX. The DIN signal isconnected to the one gates of P channel transistor 170 and N channeltransistor 172. The output of inverter 164 is connected to the gate of Pchannel transistor 182 and N channel transistor 184. The DMX input isconnected to the gates of N channel transistor 174, 176 and 178, andalso to the gate of P channel transistor 180. The first source/drain ofN channel transistor 178 is connected to V.sub.cc while the secondsource/drain is connected to node 196. Similarly, the first source/drainof N channel transistor 176 is connected to ground while the secondsource/drain is connected to node 196. Node 196 is further connected tothe gate of P channel transistor 188 and the gate of N channeltransistor 186. The first source/drain of P channel transistors 188 and180 are tied and connected to V.sub.cc. The second source/drain of Pchannel transistors 188 and 180 are connected to the first source/drainof P channel transistors 182 and 170, respectively. The secondsource/drain of P channel transistors 182 and 170 are tied and connectedto node 194. The first source/drain of N channel transistors 184 and 172are tied and are further connected to node 194. The second source/drainof N channel transistors 184 and 172 are connected to the firstsource/drain of N channel transistors 174 and 186, respectively. Thesecond source/drain of N channel transistors 174 and 186 are connectedto ground. Node 196 is also connected to the gates of N channeltransistors 192 and 190. The first source/drain of N channel transistor192 is connected to V.sub.cc. The second source/drain of N channeltransistor 192 is connected to the first source/drain of N channeltransistor 190 and this combined signal represents the DOUT signal ofthe test cell. The second source/drain of N channel transistor 190 isconnected to ground.

The present invention retains high speed performance on theobservability data input (ODI), maintains a zero hold time on the shiftdata input (SDI), increases the setup time on SDI and increases thepropagation delay from the clock transition to the SDO output. A zerohold time on SDI eliminates any abnormal data propagation problem in acascaded configuration. A large setup time on SDI and a slight increaseon the clock-to-Q delay enhances the clock skew margin to eliminatepropagation errors due to skew between the various components of thetest cell.

Two weak inverters 108 and 110 are used in the first multiplexer 22 inorder to slow the serial data input and therefore increase the setuptime. Since these inverters apply only to the SDI input, no performancedegradation to the ODI input is introduced by this method. Another twoinverters 150 and 152 are inserted in the output path of SDO to slightlyincrease the clock-to-C propagation delay. A SPICE characterizationshows that the invention has min/max SDI setup of 2/14 nanoseconds, azero SDI hold time and min/max clock-to-Q delay of 0.96/5.96nanoseconds. This data leads to a min/max clock skew margin of2.96/19.96 nanoseconds.

The test cells of the present invention provide significant advantagesover the prior art. First, the test cell of the present invention may beused to perform internal and external boundary testing simultaneously inorder to reduce overall test time. Second, the test cells are capable ofsampling or inserting data at the boundary during normal operation ofthe host integrated circuit. Third, the test cell is synchronous inoperation with a free running test clock. Fourth, the present inventionprovides a method of toggling an IC's output buffers, independent of theIC's application logic, in order to achieve parametric measures and tofacilitate boundary tests. Fifth, the test cell provides self-testingcapability.

The functionality of the test cell 12 of the present invention may beenhanced through the use of cell libraries, in which additionalcircuitry may be provided on one or more of the test cells 12 used in IC10 to provide an enhanced test circuit. A library of such circuits maybe provided to enable a circuit designer to customize a particular IC10.

Referring to FIG. 6, a maskable comparator logic section 200 is shown inconnection with the test cell 12 of the present invention. The maskablecomparator logic section 200 adds comparability test features foreffectuating a test in response to a condition.

The maskable comparator logic section 200 comprises XOR gate 202 and aDIAND 204. The XOR gate 202 has two inputs: a first input connected tothe DIN and ODI inputs to the test cell 12 and a second input connectedto an expected data (EXPD) signal. The NAND 204 also has two inputs: oneinput connected to the output of the XOR gate 202 and a second inputconnected to a compare mask (CMPMSK) signal. The output of the NAND gate204 provides a compare output (CMPOUT) signal.

The maskable comparator logic 200 provides a means to compare logiclevel appearing at the DIN input of the test cell 12 against apredetermined logic level appearing at the EXPD input. If the logiclevel on the DIN input and the EXPD input match, the output of theexclusive OR gate will driven low. If the logic level on the DIN inputand the EXPD input do not match, the output of the exclusive OR gatewill be driven high. A low level output (match condition) from theexclusive OR gate will cause the NAND gate to output a high level viathe CMPOUT output. The high level output (no match) from the exclusiveOR gate 202 will cause the NAND gate 204 to output a low logic level viathe CMPOUT output, unless the CMPMSK input to the NAND gate 204 is at alow level.

A high logic level on the CMPOUT output of the comparator logic section200 indicates that the input or output boundary signal passing throughthis particular test cell is equal to an expected condition. By havingsimilar test cells at every input and output signal of an integratedcircuit, along with logic to detect the condition where all the CMPOUTsignals from the various test cells are high, it is possible to detectthe occurrence of an expected boundary condition over the entire rangeof an integrated circuit's inputs and outputs.

In some boundary compare applications, the condition of one or more ofthe integrated circuits inputs and/or outputs may be irrelevant. Inthese circumstances, the comparator logic 200 may be forced to mask offthe compare operation and output a high level on the CMPOUT outputregardless of the result of the compare operation. This capabilityallows for “Don't Care” comparison conditions to be set around theboundary of an integrated circuit design. The Don't Care condition isachieved by setting the CMPMSK of a particular test cell to a low logiclevel. All test cells having a low level applied to their CMPMSK inputwill output a high logic level from their CMPOUT output. By forcing theCMPOUT output high, the test cells with Don't Care conditions do notinfluence the overall result of a comparison taking place in other testcells at the boundary of an integrated circuit.

In some applications, the test cells may be required to providePseudo-Random Pattern Generation (PRPG) and/or Parallel SignatureAnalysis (PSA) capabilities at the boundary of an integrated circuit tofacilitate testing. In the PRPG mode, a series of seriallyinterconnected test cells can be made to generate a pseudo-random outputpattern sequence from the DOUT outputs. In the PSA mode, a series ofserially interconnected test cells can be made to compress the dataappearing at the DIN input into a “signature” for testing purposes.

A preferred implementation of a library cell capable of implementing PSAtest logic is shown in FIG. 7. The inputs and output of the base testcell 12 comprises the signals described in connection with FIG. 2.Additionally, the PSA logic section 206 receives two input signals, DataMask (DATMSK) and PSA Enable (PSAENA). The DATMSK and PSAENA inputs areextensions of the control bus.

The PSA logic section 206 comprises an Exclusive OR gate 208 and twoNAND gates, 210 and 212. The NAND 210 is connected to the DATMSK signaland the DIN input signal. The NAND gate 212 is connected to the PSAENAsignal and the SDI signal. The outputs of the NAND gate 210 and 212 areconnected to the inputs of the Exclusive OR gate 208. The output theExclusive OR gate is connected to the ODI input of the base test cell12.

When the PSA logic section 206 is attached to the base cell 12, thenormal-connection of the ODI input to the DIN input is modified suchthat it is no longer a direct interconnect. However, the base functionof capturing test data during a load operation via the ODI input isstill valid, but addition rules set forth below and signal routing isrequired to accommodate the load operation via the PSA test logic. Allother functions (idle, shift and toggle) and their required cell to cellinterconnects remain the same.

To achieve the basic load operation, the DATMSK and PSAENA inputs to thelogic section 206 are set to a high and low logic level, respectively.In this condition, the PSA logic section provides a routing path fromthe DIN input, through the NAND gate 210 and the Exclusive OR gate 208to the ODI input of the base test cell 12. When the load operation isissued, the test cell 12 captures the logic level on the DIN input viathe routing channel through the PSA logic section 206.

When a PSA operation is to be performed by the test cell, the MSKDAT andPSAENA inputs are both set to a high logic level and control is issuedto the base test cell 12 to perform a load operation. With the MSKDATand PSAENA inputs set in this manner, the PSA logic section 206 performsan Exclusive OR operation on the logic levels present on the DIN and SDIinputs, and outputs the result to the ODI input of the test cell 12.During the load operation, the test cell 12 samples the ODI input,storing the result of the Exclusive OR operation. The local Exclusive ORand load operation performed in each test cell 12, in combination withthe required cell to cell interconnect for serial shifting (i.e., theSDI of one cell connected to the SDO of another) and polynomialfeedback, forms the basis from which a boundary scan signature analysisstructure can be implemented.

During a PSA operation, the PSA logic section 206 provides a means tomask off the effect of the DIN input on the Exclusive OR operation. Themasking is achieved by setting the MSKDAT input low while leaving thePSAENA input high. When the MSKDAT input is set low, the PSA logicsection 206 couples the SDI input to the ODI input of the test cell 12and only the value of a preceding cell's SDO output is sampled andstored in the test cell 12. This capability allows masking out thesignal attached to the DIN input of one or more of the test cells duringa PSA operation at the boundary of an integrated circuit.

When a PRPG operation is to be performed by the test cell, control isissued to cause the test cell 12 to perform a shift operation from theSDI input to the SDO output.

During PRPG, data is shifted through a series of test cells 12 toproduce a pseudo random output pattern. The resulting pseudo randompattern generation output is determined by the length of the scan pathand the polynomial feedback connections of the test cells 12 in the scanpath. Also, the hold and DMX inputs to the test cell will be set high,allowing the generated test signal to be driven out of the test cell'sDOUT output.

In applications using test cells with PRPG and/or PSA test features, itis beneficial to provide a Programmable Polynomial Tap to allow theadjusting the polynomial feedback connection between the test cells 12to suite a particular group or range of test cells at the boundary of anintegrated circuit. The advantages of including this feature are: (1)simplification of the implementation of test cells in an integratedcircuit design, (2) elimination of the need to add external polynomialtap capability, and (3) improvement of the placement and signal routingof test cells in an integrated circuit layout, since all the requiredlogic is resident within each test cell 12.

The preferred implementation of a test circuit comprising a base testcell 12, PSA logic section 206 and a Programmable Polynomial Tap 214 isshown in FIG. 8. The inputs and outputs to the test cell 12 and the PSAlogic section are the same as shown in FIG. 7. The ProgrammablePolynomial Tap logic section 214 requires two additional input signals,Polynomial Tap Enable (PTENA) and Feedback Input (FBI), and oneadditional output signal, Feedback Output (FBO). The PTENA signal is anextension of the control bus. The FBI and FBO signals provide theinterconnect between test circuits for implementing the polynomialfeedback network, required for the PRPG and/or PSA test operations. TheProgrammable Polynomial Tap logic section comprises an Exclusive NORgate 216 and a NAND gate 218. The NAND gate receives the SDO output ofthe associated test cell 12 and the PTENA signal as input. The ExclusiveNOR gate 216 receives the output of the NAND gate 218 and the FBIsignal. The output the Exclusive NOR gate 216 is the FBO signal.

A key capability required to perform PRPG or PSA is to provide afeedback network which is based on the Exclusive OR of the logic statein all or a selected group of test circuits in scan path. The result ofthis feedback network is input to the first test circuit in the scanpath to close the feedback loop. In FIG. 8, the combination of the NAND218 and Exclusive NOR gate 216 provide the capability to include orexclude the logic state of the particular test circuit in the feedbacknetwork.

Test circuits having similar Programmable Polynomial Tap logic sectionsmay be interconnected together as shown in FIG. 9 a. Four test circuits220 a-d having PRPG/PSA logic sections and Programmable Polynomial Taplogic sections are interconnected in the scan path from the primaryserial data input (PSDI) to the Primary Serial Data Output (PSDO)signal. The Programmable Polynomial Tap logic of each test cell 220 a-dis interconnected in such a way that a trailing test circuit's FBOoutput signal supplies the input for a leading test circuit's FBI input.For example, the FBO of test circuit 220 c is connected to the FBI oftest cell 220 b. The PTENA input for each test circuit 220 a-d isapplied via the PTENA bus. A feedback select (FBSEL) input (an extensionof the control bus 17) controls a multiplexer 222 at the input of thefirst test circuit 220 a which feeds the SDI input of the test circuit220 a. The FBI input of the last test circuit 220 d is wired to a lowlogic level so that it have no effect on the Programmable polynomial Taplogic of the last test circuit 220 d.

During normal shift operations, serial data enters PSDI and flowsthrough the test cells and out PSDO. When placed in the PRPG or PSAmode, the multiplexer 222 at the input of first test circuit 220 aselects the feedback result (FBR) signal to be connected to the SDIinput of the first test circuit 220 a. The Programmable Polynomial Taplogic in the test circuits 220 a-d, in combination with the FBI and FBOwiring interconnects, forms the Exclusive OR feedback network requiredfor PRPG and PSA operations. If the PTENA input of a test circuit ishigh, the logic state of test cell 12 of that test circuit 220 isincluded in the feedback network. If the PTENA input to a test circuitis low, the logic state of the test cell 12 of that test circuit is notincluded in the feedback network.

In some application it may be necessary to partition a primary scanpath, consisting of a series of test cells 12, each having PRPG/PSA andProgrammable Polynomial logic, into sections. Each section of theprimary scan path may be configured as shown in FIG. 9 b to providemultiple localized PRPG/PSA test functions within the primary scan path.Each section of the scan path has a feedback connection as shown in FIG.9 a to allow selecting the appropriate test cells 12 in the scan pathsection to be included in the local feedback network. The FeedbackResult (FBR) of each local feedback network is coupled up to the firsttest cell 12 in a scan path section, via a multiplexer.

The PSA test logic may also be included in the bidirectional test cellof FIG. 4. The inclusion of the PSA test logic provides the samebenefits to bidirectional test cells as described in the unidirectionalcase.

A preferred implementation of a test circuit comprising a base test cell12, bidirectional multiplexer logic and a PSA logic section 206 is shownin FIG. 10. The input and output signals required for this test circuitare the same as those used in connection with FIGS. 4 and 7. The onlychange required to create the bidirectional test circuit with PSA logicis to insert the PSA logic and make the following wiring connections:(1) connect the SELODI output of the second multiplexer 34 up to theinput of PRPC/PSA NAND gate 210 shown connected to DIN in FIG. 7, (2)connect the SDI input attached to the test cell up to the input ofPRPG/PSA NAND gate 212 as shown in FIG. 7, and (3) connect the output ofPRPG/PSA exclusive OR gate 208 up to the ODI input of the test cell 12.

FIG. 11 illustrates a bidirectional test circuit having both a PRPG/PSAlogic section 206 and a Polynomial Tap logic section 214. The circuit ofFIG. 11 is identical to the circuit of FIG. 10 with the additionalPolynomial Tap logic section 214 connected to test cell 12 asillustrated in connection with FIG. 8. Similarly, other combinations oflibrary cells are available for the bidirectional test circuit, such asa bidirection test circuit including maskable compare logic or abidirectional test circuit including maskable compare logic, PRPG/PSAlogic and polynomial tap logic.

While the cell library of the present invention has been discussed inconnection with the base test cell 12 of FIG. 2, the concept could beused with a base test cell 12 having another architecture. The librarycells provide a integrated circuit designer with a range of bit slicetestability cells that can be used to construct a variety of differentintegrated circuit test structures. The advantages of providing testsolutions in the form of library cells are: (1) simplification of theimplementation of test architectures in integrated circuit designs, (2)providing structured test methodologies that can be automated, (3)elimination of the need to construct ad-hoc test approaches for everynew integrated circuit design, (4) improvement of placement and signalrouting of test architectures, since all required test logic is residentwithin the test circuits and, (5) providing the customer with a basisfrom which desired testability features may be selected.

To facilitate testing at the tC through system level, standardoff-the-shelf components, such as registers, latches, buffers ortransceivers, may be designed to include a test interface and a boundaryscan path comprised of test cells 12. Implementing test circuitry intostandard components for the purpose of simplifying test at higher levelsof assembly provides a method of reducing the cost to test and maintainhardware systems.

Today, the testing of circuit boards and systems requires the use ofexpensive test equipment and mechanical probing techniques. In order totest a board residing in a system, it must be removed so that testaccess to test equipment is available.

Standard components with embedded test circuitry that is accessible viaa serial test interface, simplifies testing. A board design which usessuch parts can be tested while it remains in the system, via the serialtest bus. Also such devices allow testing to be performed with simpler,less expensive test equipment. In addition, with state of the art boarddesigns, it may not be physically possible to probe a circuit because ofthe component density. In this case testing may only be performed viathe test circuitry embedded in the components.

FIG. 12 illustrates a situation where combinational logic 224 is beingobserved and controlled by test partitioning devices 226 and 228. Thetest partitioning devices 226 and 228 could be based on a number ofwell-known devices such as buffers, latches, registers or transceivers.For purposes of illustration, it is assumed that the partitioningdevices 226 and 228 are 8-bit registers. The combinational logic maycomprise any number of circuits without in-circuit testing ability.

The input test register 226 may observe the data which would otherwisebe sent to the combinational logic, and may output data to control thecombinational logic 224. The output test register 228 may observe thedata output from the combinational logic 224 and may control the outputto devices which would otherwise be connected to the output of thecombinational logic 224. Serial data is received by the input testregister 226 which outputs serial data to the output test register 228.By observing inputs and controlling outputs, the test register 226 and228 may test the combinational logic 224 in much the same way aspreviously described in connection with FIG. 1.

FIG. 13 illustrates an embodiment of a test device 226. Data inputs D0-7are input to the test device 226 through input buffer 230. The output ofinput buffer 230 is connected the an input test circuit register (inputTCR) 232. The output of the test circuit register 232 is connected to aregister 234. The output of the register 234 is connected to an outputtest circuit register (output TCR) 236. The output of the output TCR 236is connected to an output buffer 238, which provides the output datasignals Q0-7. Test cells 240 and 242 receive control signals fromoutside the device. In this case, test cell 242 receives a clock input(CLK) and test cell 240 receives a control input (OC). The output oftest cell 240 is connected to the output buffer 238 for tri-stateoperation. The output of test cell 242 is connected to the clock inputof register 234. The SDI signal from outside the test device 236 isreceived by the test cell 240, a scan bypass register 244 and aninstruction register 246. A scan data path exists through the test cell240, test cell 242, the input TCR 232 and the output TCR 236. Serialdata output of the output TCR 236 is connected to a multiplexer 248along with the output of the scan bypass 244. The multiplexer 248receives a scan path select signal from the instruction register 246.The output of the multiplexer 248 is connected to a multiplexer 250along with an output from the instruction register 246. The multiplexer250 also receives a select signal from a test port 252. The test portreceives MODE and clock (CLK) signals from outside the test device 226and outputs scan and test control signals. The instruction register 246also outputs test, control signals to the test cells 240 and 242 andTCRs 232 and 236.

It should be noted that the control signals (CLK and OC) input to thetest register are exemplary, and other signals may be used for aspecific application. For example, a clear signal or an enable signalcould be connected through a test cell to a suitably designed register.Also, the register could be replaced by appropriate circuitry toimplement a latch, buffer, transceiver or other device. Also, the numberof control and data I/O signals may change depending on theimplementation of the device.

The scan structure of the test device 226 comprises a boundary scan path(through the test cells 240 and 242 and TCRs 232 and 236), a scan bypasspath and an instruction scan path. A scan access protocol issued via theMODE and SCK inputs allows serial data to be scanned into either theboundary or bypass scan path, or the instruction register. The selectionbetween the boundary or bypass scan path is determined by the currentinstruction residing in the instruction register, via the scan pathselect output to multiplexer 248.

The TCRs 232 and 236 comprise a plurality of test circuits based on thetest cell 12, as discussed previously. Typically, the TCRs 232 and 236will be formed from a plurality of test circuits with PRPG/PSA and/orprogrammable polynomial tap logic sections. The test cells 240 and 242are typically base test cells 12 without additional circuitry. Thecontrol circuitry to the test cells 240 and 242 and TCRs 232 and 236 isnot shown; however, a control bus would be connected to each cell forserial data shifting and test circuit control.

Test instructions may be scanned into the instruction register 246 tocause the boundary scan logic to perform a test operation. If a test isnot being performed, a normal operation instruction is scanned into theinstruction register 246. During a normal operation instruction, theboundary scan logic allows normal I/O and control signals to flow freelythrough the boundary scan logic.

A “boundary scan instruction” may be installed in the instructionregister to allow the boundary scan path (through the TCRs 232 and 236and the test cells 240 and 242) to take control of the internal I/Osignals. This control is accomplished by setting the DMX input of theboundary scan cells to a high logic level. In this mode, externalcontrol can be issued by the MODE and SCK input to cause the boundaryscan path to capture the logic level on the DIN inputs of the test cells240 and 242 and TCRs 232 and 236. During the capture operation, the testcells 240 and 242 and input TCR 232 capture the state of the externaldata outputs (D0-7) and control inputs. Also during the captureoperation, the output TCR 236 captures the state of the internal logic234. After the data has been captured, additional external control isinput via MODE and SCK inputs to cause the boundary scan path to shiftout the captured data for inspection via the SDO pin.

While the captured data is shifted out, a test control pattern isshifted into the boundary scan path via the SDI input. During thecapture and shift operation, the DOUTs will remain in their presentstate because the HOLD input thereto will be set low. If not heldconstant, the ripple effect at the output could upset external logicattached to the outputs of the device.

When the shifting in and out of the boundary scan path is complete,additional external control is input via the MODE and SCK inputs tocause the previously installed control pattern to be applied from thelatches 26 of the various test cells and TCRs 240, 242, 232 and 236. Theprocess of capturing the boundary scan path inputs, followed by shiftingout the captured data for inspection while shifting in the next testcontrol pattern to be applied from the boundary scan path outputs isrepeated until the desired level of testing is complete. In this way,the interior logic and external wiring interconnects and/or aneighboring ICs may be simultaneously tested.

A “boundary data sample instruction” may be installed in the instructionregister 242. The boundary data sample instruction allows data andcontrol to pass freely through the boundary scan path while the SCK andMODE inputs cause the boundary scan path to capture the logic stateexisting at their inputs. Once the boundary data has been captured,additional external control is issued via the SCK and MODE inputs tocause the boundary scan path to shift out the captured data forinspection via the SDO pin.

A “control outputs to high impedance state instruction” allows theoutput buffers (Q0-7) to be placed in a high impedance state. Althoughthe outputs are in a high impedance state, the inputs remain functionaland data and control inputs still affect the internal logic 234. Duringthis instruction, the scan bypass register (a single flip-flop) iscoupled to the SDI and SDO pins, to form a single bit scan path throughthe test device during data register scan operations.

The benefit of this instruction is to place the outputs in a tristatecondition, which allows an external test probe to be applied to controlthe outputs to a logic 1 or 0. Also, the abbreviated data scan paththrough the scan bypass flip-flop allows reducing the internal scan pathlength to a single bit.

A “control boundary outputs to a logic 1 or 0 instruction” allows theboundary scan path to take control of the I/O signals in order to applya prescanned test control pattern from the outputs of the test cells 240and 242 and TCRs 232 and 236. Prior to performing this test instruction,the boundary scan path will have been scanned to install the testcontrol output pattern to be applied by the instruction. During thisinstruction, the scan bypass register is coupled to the SDI and SDO pinsin order to form a single bit scan path through the test device duringdata register scan operations.

The benefit of this instruction is to allow the test device to output aparticular pattern while testing is being performed on other devicesconnected to the test device output, such as the combinational logic224. Also, the abbreviated data scan path through the scan bypassflip-flop during instruction allows the internal scan path length to bereduce to a single bit.

The input and output TCRs 232 and 236 may be instructed to operatesynchronously with the external applied SCK input to provide additionaltesting capabilities. The benefit of these test operations is that noscanning is required during the test operation, thus reducing the testtime significantly.

The PSA operation is discussed in detail in connection with FIG. 7. Theinput TCR 232 may perform the PSA operation either by itself or inconjunction with the output TCR 236. A circuit showing the input andoutput TCRs 232 and 236 used in conjunction to provide a 16-bit widesignature (assuming 8-bit TCRs) is illustrated in FIG. 14. Dataappearing at the data input is summed with the present state of theinput TCR 232 and is clocked into the input TCR 232 by the PSA/PRPG testclock signal output from the AND gate 253. During a PSA operation, theinput TCR 232 is placed in the load mode and the output TCR 236 isplaced in a shift mode and acts as an 8-bit shift register extension tothe input TCR 232. By combining the input TCR 232 with the output TCR236, a 16-bit wide signature of the 8-bit data input bus is available.Using a 16-bit PSA circuit, the number of input data patterns that canbe compressed into the input TCR 232 is increased from 255 to 65,535.During PSA operations, the data output (Q0-7) from the output TCR 236 isfixed to a predetermined pattern, so that the rippling data during PSAis not propagated out to the combinational logic 224.

The clocking for PSA comes from a gating circuit shown in FIG. 14. Whenthe PSA instruction is installed and the external control has placed thetest port 252 in an idle state, the gating signals are adjusted to allowthe AND gate 253 to pass the SCK input to the TCRs 232 and 236. Theinstruction register 246 outputs a test clock enable signal when theinstruction is installed. The test port 252 outputs a sync signal whenit enters a non-scanning idle state. When both enable signals are sethigh, the external SCK is gated through the AND gate 252 to produce thePSA/PRPG test clock.

At the end of a PSA instruction, the external control (SCK and MODE)will cause the test port 252 to inhibit the PSA/PRPG test clock and anew instruction will be scanned into the instruction register 246. Afterthe scan path is set back to its normal configuration, the signaturestored in the TCRs 232 and 236 can be scanned out for inspection via aboundary scan read instruction, explained hereinbelow.

Similarly, a PRPG instruction may be installed in the instructionregister 246 to provide output pattern generation. Once again, the TCRs232 and 236 may be combined to provide a 16-bit wide pattern generationcapable extending the number of 8-bit output patterns. The 16-bitconfiguration is similar to that shown in FIG. 14. During a PRPGoperation, both TCRs are placed in a shift mode. The pattern generationis output from the output TCR 236. Clocking for PRPG is identical tothat described in the PSA instruction. Similarly, a new instruction willbe scanned into the instruction register at the end of a PRPG operationto reset the test clock enable bit and re-configure the boundary scanpath to its normal routing path.

As shown in connection with FIG. 15, PSA and PRPG may be runsimultaneously. In this configuration, the input and output TCRs 232 and236 are not combined, but rather fed back into themselves. Localmultiplexers 254 and 256 provide the required feedback connections tothe TCRs 232 and 236 respectively. Since the TCRs cannot be linkedtogether in this configuration, the PSA and PRPG operations are limitedto 8-bits. The clocking for the PSA and PRPG operations is identical tothat described in connection with the PSA instruction.

Similar in configuration to the simultaneous PSA and PRPG instruction inFIG. 15, a simultaneous PSA and binary count up pattern outputinstruction may also be performed. During this instruction, the inputTCR 232 performs PSA and the output TCR 236 outputs a binary count uppattern. The clocking for the PSA and binary count up pattern operationsis identical to that described in connection with the PSA instruction.The binary count up pattern is useful in providing binary addresspatterns during memory testing. During this instruction a memorydevice's address may be stimulated by the count up pattern from a TCR236 of one test register while its data output is compressed by a TCR232 of another test register. A similar test application would beperformed by a PSA and PRPG instruction.

In FIG. 16 the test cells 12 of TCR 236 are shown attached to a CountEnable Logic section 258 to allow a binary count up pattern to be outputfrom TCR 236. The count enable logic 258 comprises a plurality of ANDgates 260. Each AND gate 260 receives the output of the previous ANDgate as one input and the DOUT signal from an associated test cell 12 asthe other input. The first AND gate 260 receives the DOUT signal fromthe first two test cells 12. The output of each AND gate 260 isconnected to one A select part of the next test cell 12. In thisarrangement, the least significant test cell 12 in TCR 236 is set toToggle Mode (AB=01) and leading test cells 12 are set to operate eitherin Toggle Mode or Idle Mode (AB=11), depending on the logic level outputfrom the Count Enable Logic to the A inputs of each test cell 12. A testcell 12 will toggle when a PSA/PRPG test clock is applied if alltrailing test cells are set to a high logic level. A test cell 12 willremain in its present state (Idle) when a PSA/PRPG test clock is appliedif any trailing test cell is set to a low logic level.

Other functions previously described in connection with the test cell 12may be performed by the testing device. The testing device may be madeto perform a toggle operation wherein data installed in the output TCR236 during a prior scan operation can be made to toggle between the trueoutput pattern and its compliment output pattern during each PSA/PRPGtest clock cycle. The toggle capability is useful during the testing ofthe device's output buffers and at the board level as a simple testpattern generator. The clocking for the toggle operation is identical tothat described in the PSA instruction.

The boundary scan path can also be read to determine the contentsthereof. The testing device remains in a normal operating mode duringthis operation. This instruction differs from the boundary scan andboundary data sample instructions in that the capture operation is notperformed. The boundary read instruction may be used to extract theresults of a PSA operation.

Although the present invention has been described in detail, it shouldbe understood that various changes, substitutions and alterations can bemade herein without departing from the spirit and scope of the inventionas defined by the appended claims.

1. A boundary scan test cell for use in conjunction with an integratedcircuit containing application logic circuitry comprising: a firstmemory for storing serial data and transmitting said serial data toother test cells; and a second memory connected to said first memory forstoring output data.
 2. The test cell of claim 1 and further comprisingcircuitry connecting said second memory to the application logic.
 3. Thetest cell of claim 1 and further comprising circuitry to connect theoutput of said second memory to the input of the first memory.
 4. Thetest cell of claim 1 and further comprising hold circuitry to maintainthe output of said second memory at a given state.
 5. The test cell ofclaim 1 and further comprising toggle circuitry to alternate the outputof said second memory between first and second logic levels.
 6. The testcell of claim 1 wherein the output of said first memory is connected tothe output of said second memory such that said second memory can beloaded with a predetermined logic value.
 7. The test cell of claim 1 andfurther comprising circuitry to connect said first memory to an input ofthe integrated circuit.
 8. The test cell of claim 1 and furthercomprising circuitry to connect said second memory to an output of theintegrated circuit.
 9. A boundary scan test cell comprising: a firstmemory; a first multiplexer for connecting one of a plurality of inputsto said first memory responsive to a first control signal; a secondmemory connected to the output of said first memory; and a secondmultiplexer for selecting an output from one of a set of inputs to thesecond multiplexer including the output of said second memory responsiveto a second control signal.
 10. The test cell of claim 9 wherein saidfirst memory comprises a D-type flip-flop.
 11. The test cell of claim 10and further comprising clock circuitry for producing a clock signalconnected to said D-type flip-flop, such that the output of said firstmultiplexer is stored in said first memory at each clock pulse.
 12. Thetest cell of claim 9 wherein said second memory comprises a D-typelatch.
 13. The test cell of claim 12 and further comprising controlcircuitry connected to said latch for producing a hold signal responsiveto which said latch stores data output from said first memory.
 14. Thetest cell of claim 9 wherein said second memory includes inverted andnon-inverted outputs, said inverted output connected as one of saidinputs to said first multiplexer, such that a toggled output may beproduced by the test cell.
 15. The test cell of claim 9 wherein theoutput of said first memory is connected as one of said inputs to firstmultiplexer.
 16. An integrated circuit having boundary scan testing,comprising: application logic circuitry having one or more inputs andone or more outputs; one or more data inputs for receiving data into theintegrated circuit; one or more data outputs for outputting data fromthe integrated circuit; a test data input for receiving test data intothe integrated circuit; one or more input test cells connected betweenrespective data inputs and said application logic circuitry, said inputtest cells comprising: a first memory for storing serial data; and asecond memory connected to said first memory for storing output data.